Semiconductor Packaging
Test Service & Test Solutions
Teat services
KOSCO INDUSTRIES is offering a competitive Wafer Probe Test Service by acquiring and merging Taiwanese semiconductor post-processing companies with 100% equity capital. The company is also advancing the establishment of equipment production facilities essential for semiconductor post-processing and testing, with the aim of commencing operations in the first half of 2025.
코스코인더스트리는 대만 반도체 후공정 기업을 100% 자기 자본으로 인수 합병하여 경쟁력 있는 Wafer Probe Test Service를 제공하고 있으며, 용역 외 반도체 후공정 및 테스트에 필요한 장비 생산 시설을 2025년 상반기 가동을 목표로 추진하고 있습니다.
Probe Test
- As per Customer's Device Specifications, Parameters, Vectors and Test Programs
- 6, 8 & 12" Wafers and Bumped Wagers
- Temperature Range : -55℃ to +150℃
- Class 1K Particle Environment
Final Test
- Wide range of IC packages such as PDIP, PLCC, SOIC, QFP, LQFP, TQFP, QFN, MLF, BGA, LGA, SIP, FLIP CHIP, POP, PLP and others
- Pick & Place and Turret Handlers availble
- Temperature Range : 55℃ to +150℃
- Class 10K Particle Environment
Backend
- Lead, Ball and Package Inspections
- Marking Inspections
- Bake Dry
- Tray and Tape & Reel Packings
- Shipments to Customer Sites or Customer's Customer Locations
Trunkey Service
Taiwan. USA. We provide smooth and efficient Trunkey Service in close cooperation with Fab Foundry and Package companies in Korea.
대만. 미국. 한국에 있는 Fab Foundry 및 Package 회사들과 긴밀하게 협력하여 원활하고 효울적인 Trunkey Service를 제공합니다.
Test Solutions
Design-to-Test Solutions
We provide the latest solutions to reduce the cost of design-to-test, time-to-market, time-to-volume production and test for our customers.
고객의 Design-to-Test, Time-to-Maket, Time-to-Volume Production 및 Test Cost를 줄이는 최신의 Solution을 제공합니다.
Test Development
- Test Spec Verification
- Test Program Development
- Product Characterization
- Product / Test Correlation
Test Vector Conversion
We provide test vector conversion from test programs of ASCII, Verilog VCD, WGL, STIL and other test platforms to various test platforms owned by KOSCO INDUSTRIES.
ASCII, Verilog VCD, WGL, STIL 및 기타 다른 Test Platform의 Test Program으로부터 코스코인더스트리가 보유하고 있는 각종 Test Platform으로의 Test Vector Conversion을 제공합니다.
Probe Card and Load Board Design
- Probe Card design and supply
- Load Board design and supply
- Test Socket Design and Supply
- Handler Change-Over-Kit design and supply
Test Data Management
We have established a Test Data Feedback System, and each customer's test data is kept for at least 3 years. In addition, Test Data is provided to customers through FTP, and customers can directly access the Data Server of KOSCO INDUSTRIES by logging on with the given Username and Password.
Test Data Feedback System을 구축해 두고 있으며 각 고객별 Test Data는 최소 3년간 보관되고 있습니다. 또한 Test Data는 FTP를 통해 고객에게 제공되기도 하고 고객은 부여받은 Username과 Password로 Log on하여 코스코인더스트리의 Data Server에 직접 Access 할 수 있습니다.
Test Status and Yield Monitor
The On-Line Monitoring System (OMS) is running 24 hours a day, 365 days a year, and customers can log on with the given username and password to monitor test status and test yield.
365일 24시간 On-Line Monitoring System(OMS)을 가동하고 있으며 고객께서 부여받은 Username과 Password로 Log on 하여 Test Status 및 Test Yield 등을 Monitor 할 수 있습니다.
Logic, Mixed Signal & SOC
We have High Performance Testers to efficiently test Logic, Mixed Signal and SOC Devices such as MCU, Touch Controller, Timing Controller, ISP, DTV Chipset, Application Processor, Automotive and Mobile.
MCU, Touch Controller, Timing Controller, ISP, DTV Chipset, Application Processor, Automotive 및 Mobile 등과 같은 Logic, Mixed Signal 및 SOC Device 들을 효율적으로 Test 하기 위한 High Performance Tester들을 보유하고 있습니다.
Analog & Mixed Signal
We have High Performance Testers to efficiently test Analog and Mixed Signal Devices such as Audio, Video, PMIC, Automotive and Mobile.
Audio, Video, PMIC, Automotive 및 Mobile 등과 같은 Analog 및 Mixed Signal Device들을 효율적으로 Test 하기 위한 High Performance Tester들을 보유하고 있습니다.
Glass Defects Detection Machine
Glass Defects Detection Machine is a fully automated detector that focuses on identifying defects in glass. This equipment combines a high-precision camera and special LED with our independently developed CCD software to detect scratches, smudges, corrosion, white and black dots, foreign matter, and concave or convex points. This significantly reduces the cost of traditional manual labor.
Features
- Untouched vision correction system, automatically adjusts.
- Real-time monitoring through a clear interface.
- Untouched transmission, avoiding double infection.
- Flexible for various product sizes.
Light Guide Plate Detector Equipment
This system consists of a horizontal four-joint robot, an automatic cleaner, a film cover device, and CCD AI software. It is primarily used to detect surface defects on LGP, such as white dots, scratches, and smudges. The horizontal four-joint robot used in this equipment is able to move quickly and precisely, and it is also easy to manipulate. When combined with CCD detecting software, it is capable of significantly enhancing production efficiency.
Features a self-cleaning transmission belt to prevent cross-contamination.
Customizable AI vision algorithm that can be adjusted for different products.
Imitate the human observation angle to detect specific defects. Automatically sorting and stacking.
Line scanning AOI device based on deep learning
The products from the assembly line are transported to the visual inspection station via the conveying mechanism. Subsequently, they are captured by the line scan camera at the station from various angles, including the front and the side. The AOI visual inspection system simulates the human eye to detect products, distinguishing between qualified and defective items, which are then sorted and discharged by the conveying mechanism.
Features
High-sensitivity direct-drive turntable designed for flexible rotation.
Customization AI vision algorithm can be tailored to different products.
Automatically identify the location and information of the defective products.
The vision software, composed of multiple line scan cameras, industrial lenses, special combination lights, and light controllers, can quickly switch between product specifications.
Flip-chip Mounter
The reclaimer arm will transport the dies to the wafer expanding device, and the substrates reclaimer will transport the substrates to the conveyor belt, which will then send the substrates to the working area simultaneously. The conveyor belt will transport two substrates simultaneously under the guidance of machine vision. On the other hand, the ejector pin will lift the die, and the flip-action arm will pull the die and rotate it 180 degrees to allow the mounter arm to remove the die and transfer it to the scaling powder station. After dipping in flux, the mounting arm will place the DIE on the substrate precisely under the guidance of machine vision. When two substrates are fully loaded, they will be transported to the receiver in the same way as the wafer.
Application
Chip packaging (flip chip process)
Features
Untouched vision correction system, automatically adjusts.
Continuous material replacement.
Two-sided mounting arms, efficiently enhanced.
A double-track structure was adopted in the XY moving system.
Real-time monitoring through a clear interface.
High-precision, high-stability mechanical structures and transmission components.
Taiwan Factory #1
Taiwan Factory #2